Target Market Segments
for 3D Circuit Printing
We want to give you the freedom
to 3D print high-resolution
or very thick electronic
circuits, bumps and bonding
layers through the AMEBA 3D
(S-ECAM for 3D Circuit) series
of machines.
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S-ECAM can print bumps or electronic circuits on high-density and high-performance PCBs required for the high-tech
electronic equipment in defense and aerospace fields. S-ECAM is capable of printing multi-thickness circuits on the
PCB substrate with advantages in terms of heat dissipation and design freedom, and it is also possible to print addi
tional 3D structures for mounting semiconductors on the PCB or the device assembly.
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