Print in the State of Metal Ions

S-ECAM stands for Selective Electrochemical Additive Manufacturing. S-ECAM can print circuit line width of 1 to 5,000 ㎛ and line Thickness of 1 to 1,000 ㎛, and it is possible to print line with an aspect ratio of 1:5 or more and Line & Space of 20 ㎛ or less, respectively.

Nano-Sized Lines on PCB

In Semiconductor Packaging, S-ECAM technology will be able to make it possible to print Nano-sized line widths on PCBs to correspond to Ångström(å)-sized line widths of Semiconductors.

3D CAD Based Optimization for Printing

S-ECAM receives 3D CAD data for an arbitrary 3D geometry or circuit, and prints them calculating the optimal path and thickness. S-ECAM allows a high degree of freedom for 3D shapes and circuits, can locally adjust the thickness of electronic circuit and enables printing of various metals through the replacement of electrolytes.

Reduce Processes & Harmful Substances

S-ECAM will be able to replace some of the existing SAP (Semi-Addictive Process) and MSAP (Modified SAP) processes with a mask-less metal printing process, which will be the beginning of the Paradigm Shift. It can reduce more than 10 process and costs related to Masking process, and can reduce harmful substances by more than 90%.

Highest fertility and ubiquitous on Earth

Among living things, the organisms with the highest fertility are single-celled animals, and the representative of them is the Amoeba. The Amoeba is one of the oldest living organisms in the history of the Earth, which appeared about 1 billion years ago, and inhabits everywhere on the planet, even below 10,641 m in the Mariana Trench. (National Geographic Channel)

Moving Path and Gap Optimization

AMEBA 3D can analyze complex 3D CAD data and print fully 3D geometry of high complexity having empty spaces inside it for the manufacturing of complicated Micro Mechanical parts and Art products. The moving path of the electrode and the gap between electrode and product should be optimized using the software algorithm developed for many years through the analysis of 3D printing experimental data.

Make MEMS higher Integration & Performance

S-ECAM will be developed to print both Horizontal and Vertical wires with the line width and spacing of 10 ㎛ or less for each, and to enable the wires with an Aspect Ratio of 1:3 or more, a Step Difference of 100 ㎛ or more, and an Inclination Angle of 85 degrees or more for MEMS (Micro-Electro Mechanical Systems) module.

Minimize Optical Loss between MLA and QD

QD MLA is an optical component that combines Micro Lens Array (MLA) and Quantum Dot (QD) layer, that is a color conversion layer. MLA is a transparent material component that arranges lenses with a diameter of 1-3 ㎛ or smaller to realize 5,000 PPI or higher resolution. QD layer is a multi-layered part of transparent and nanomaterial to convert blue light of Micro LED into red or green.